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RAMPF – RAKU® MC Microwave Curing – Next Generation Speed Technology m c technology



Sealing, Bonding. Casting. At the Speed of Light.

With the microwave technology, RAMPF has developed the Next Generation Speed Technology for sealing systems, adhesives, and casting resins. Before it is applied to the component, the material is volumetrically activated by microwave radiation directly after the application nozzle and during the flow process.

Benefits for the user:
– Faster handling of components
– Higher machine availability
– Greater economic efficiency

More Information:
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RAMPF - RAKU® MC Microwave Curing - Next Generation Speed Technology

RAMPF – RAKU® MC Microwave Curing – Next Generation Speed Technology

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RAMPF – RAKU® MC Microwave Curing – Next Generation Speed Technology
m c technology
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